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NLAST4501DFT2G Datasheet(PDF) 2 Page - ON Semiconductor

Part # NLAST4501DFT2G
Description  Single SPST Analog Switch
PDF  10 Pages
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NLAST4501DFT2G Datasheet(HTML) 2 Page - ON Semiconductor

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NLAST4501
http://onsemi.com
2
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Positive DC Supply Voltage
VCC
*0.5 to )7.0
V
Digital Input Voltage (Enable)
VIN
*0.5 to )7.0
V
Analog Output Voltage (VNO or VCOM)
VIS
*0.5 to VCC )0.5
V
DC Current, Into or Out of Any Pin
IIK
$20
mA
Storage Temperature Range
TSTG
*65 to )150
_C
Lead Temperature, 1 mm from Case for 10 Seconds
TL
260
_C
Junction Temperature under Bias
TJ
)150
_C
Thermal Resistance
SC70−5/SC−88A (Note 1)
TSOP−5
qJA
350
230
_C/W
Power Dissipation in Still Air at 85
_C
SC70−5/SC−88A
TSOP−5
PD
150
200
mW
Moisture Sensitivity
MSL
Level 1
Flammability Rating
Oxygen Index: 30% − 35%
FR
UL 94 V−0 @ 0.125 in
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
VESD
> 2000
> 100
N/A
V
Latchup Performance
Above VCC and Below GND at 85_C (Note 5)
ILatchup
$300
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Min
Max
Unit
Positive DC Supply Voltage
VCC
2.0
5.5
V
Digital Input Voltage (Enable)
VIN
GND
5.5
V
Static or Dynamic Voltage Across an Off Switch
VIO
GND
VCC
V
Analog Input Voltage (NO, COM)
VIS
GND
VCC
V
Operating Temperature Range, All Package Types
TA
*55
)125
_C
Input Rise or Fall Time,
Vcc = 3.3 V $ 0.3 V
(Enable Input)
Vcc = 5.0 V $ 0.5 V
tr, tf
0
0
100
20
ns/V
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Temperature
°C
Time, Hours
Time, Years
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
1
1
10
100
1000
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
Figure 2. Failure Rate vs. Time Junction Temperature
TIME, YEARS



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