AS7265X datasheet(54/64 Pages) OSRAM

Part #	AS7265X

Description	Smart 18-Channel VIS to NIR Spectral_ ID 3-Sensor Chipset with Electronic Shutter

PDF	64 Pages

Scroll/Zoom	100%

Manufacturer	OSRAM [OSRAM GmbH]

Direct Link	http://www.osram.com

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54 / 64 page

ams Datasheet

Page 53

[v1-04] 2018-Jul-09

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AS7265x − Soldering & Storage Information

Soldering Information

The module has been tested and has demonstrated an ability

to be reflow soldered to a PCB substrate. The solder reflow pro-

file describes the expected maximum heat exposure of compo-

nents during the solder reflow process of product on a PCB.

Temperature is measured on top of component. The compo-

nents should be limited to a maximum of three passes through

this solder reflow profile.

Figure 65:

Solder Reflow Profile

Figure 66:

Solder Reflow Profile Graph

Parameter

Reference

Device

Average temperature gradient in preheating

2.5

°C/s

Soak time

tSOAK

2 to 3 minutes

Time above 217

°C(T

1)t1

Max 60s

Time above 230

°C(T

2)t2

Max 50s

Time above Tpeak - 10°C(T3)t3

Max 10s

Peak temperature in reflow

Tpeak

260

°C

Temperature gradient in cooling

Max -5

°C/s

Soldering & Storage

Information

AS7265X Datasheet(PDF) 54 Page - OSRAM GmbH

AS7265X Datasheet(HTML) 54 Page - OSRAM GmbH

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