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LM1185SF Datasheet(PDF) 4 Page - HTC Korea TAEJIN Technology Co. |
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LM1185SF Datasheet(HTML) 4 Page - HTC Korea TAEJIN Technology Co. |
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4 / 4 page ![]() 150 mA C-MOS L.D.O. Regulator LM1185SF EQUATION 3-1: 0702 Taejin Technology Co.,Ltd. HTC 4 The maximum allowable power dissipation (Equation 3-2) is a function of the maximum ambient temperature(TAMAX), the maximum allowable die temperature(TJMAX) and the thermal resistance from junction-to-air(θJA). EQUATION 3-2: 3.3 Layout Considerations : The primary path of heat conduction out of the package is via the package leads. Therefore,layouts having a ground plane,wide traces at the pads,and wide power supply bus lines combine to lower θ JA and therefore increase the maximum allow able power dissipation limit. Equation 3-1 can be used in conjunction with Equation 4-2 to ensure regulator thermal operation is within limits.Forexample: |
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