DATA SHEET

SE2565T: 2.4 GHz High Power Wireless LAN Power Amplifier

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

202424A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • September 25, 2012

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Figure 5: SE2565T Recommended Land and Solder Pattern

Package Handling Information

Because of its sensitivity to moisture absorption, instructions on the shipping container label must be followed

regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption

may occur when the part is subjected to high temperature during solder assembly. The SE2565T is capable of

withstanding a Pb free solder reflow. Care must be taken when attaching this product, whether it is done manually or

in a production solder reflow environment. If the part is manually attached, precaution should be taken to insure that

the device is not subjected to temperatures above its rated peak temperature for an extended period of time. For

details on both attachment techniques, precautions, and handling procedures recommended, please refer to:



“Quad Flat No-Lead Module Solder Reflow & Rework Information”, Document Number QAD-00045



“Handling, Packing, Shipping and Use of Moisture Sensitive QFN”, Document Number QAD-00044

Branding Information

Figure 6: SE2565T Branding

Caution! Class 1C ESD sensitive device

SiGe

2565T

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