NXP Semiconductors

A5M20TG042

Airfast Power Amplifier Module

A5M20TG042

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Product data sheet

Rev. 1 — 20 May 2024

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16 Product documentation and tools

Refer to the following resources to aid your design process.

Application notes

• AN1955: Thermal Measurement Methodology of RF Power Amplifiers

Development tools

• Printed circuit boards

17 Failure analysis

At this time, because of the physical characteristics of the part, failure analysis is limited to electrical signature

analysis. In cases where NXP is contractually obligated to perform failure analysis (FA) services, full FA may be

performed by third party vendors with moderate success. For updates contact your local NXP Sales Office.

18 Revision history

The following table summarizes revisions to this document.

Table 17. Revision history

Document ID

Release date

Description

A5M20TG042 Rev. 1

20 May 2024

• Initial release of product data sheet