MP3H6115AC6U datasheet(4/12 Pages) FREESCALE

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Sensors

Freescale Semiconductor

MP3H6115A

Figure 2. Cross Sectional Diagram SSOP (not to scale)

Figure 2 illustrates the absolute sensing chip in the basic

Super Small Outline chip carrier (Case 1317).

Figure 3. Typical Application Circuit

(Output Source Current Operation)

Figure 3 shows a typical application circuit (output source

current operation).

Figure 4. Output versus Pressure Differential

Figure 4 shows the sensor output signal relative to

pressure input. Typical minimum and maximum output

curves are shown for operation over 0 to 85

°C temperature

range. The output will saturate outside of the rated pressure

range.

A fluorosilicone gel isolates the die surface and wire bonds

from the environment, while allowing the pressure signal to

be transmitted to the silicon diaphragm. The MP3H6115A

series pressure sensor operating characteristics, internal

reliability and qualification tests are based on use of dry air as

the pressure media. Media other than dry air may have

adverse effects on sensor performance and long-term

reliability. Contact the factory for information regarding media

compatibility in your application.

Wire Bond

Stainless Steel

Cap

Thermoplastic

Case

Die Bond

Sealed Vacuum Reference

Fluoro Silicone

Gel Die Coat

Leadframe

Absolute Elelment

Die

VS Pin 2

+3 V

GND Pin 3

VOUT Pin 4

MP3H6115A

100 nF

51 K

47 pF

GND

Pressure (Reference to Sealed Vacuum) in kPa

Min

Typ

Max

Transfer Function:

VOUT = VS x (.009xP–.095) ± Error

VS = 3.0 VDC

Temp = 0 to 85°C

3.0

2.75

2.5

2.25

2.0

1.75

1.5

1.25

1.0

0.75

0.5

0.25

MP3H6115AC6U Datasheet(PDF) 4 Page - Freescale Semiconductor, Inc

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