MPX10

Sensors

Freescale Semiconductor

5

Figure 4. Unibody Package — Cross-Sectional Diagram (Not to Scale)

Figure 4 illustrates the differential or gauge configuration

in the basic chip carrier (Case 344). A silicone gel isolates the

die surface and wire bonds from the environment, while

allowing the pressure signal to be transmitted to the silicon

diaphragm.

The MPX10 and MPXV10GC series pressure sensor

operating characteristics and internal reliability and

qualification tests are based on use of dry air as the pressure

media. Media other than dry air may have adverse effects on

sensor performance and long term reliability. Contact the

factory for information regarding media compatibility in your

application.

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Freescale designates the two sides of the pressure sensor

as the Pressure (P1) side and the Vacuum (P2) side. The

Pressure (P1) side is the side containing silicone gel which

isolates the die from the environment. The Freescale

pressure sensor is designed to operate with positive

differential pressure applied, P1 > P2.

The Pressure (P1) side may be identified by using the

following table.

Silicone

Die Coat

Die

P1

P2

Wire Bond

Lead Frame

RTV Die

Bond

Epoxy

Case

Stainless Steel

Metal Cover

Part Number

Case Type

Pressure (P1) Side Identifier

MPX10D

344

Stainless Steep Cap

MPX10DP

344C

Side with Part Marking

MPX10GP

344B

Side with Port Attached

MPX10GS

344E

Side with Port Attached

MPXV10GC6U

482A

Side with Part Marking

MPXV10GC7U

482C

Side with Part Marking