MPX53

Sensors

Freescale Semiconductor

5

Figure 4. Unibody Package: Cross Sectional Diagram (Not to Scale)

in the unibody chip carrier (Case 344). A silicone gel isolates

the die surface and wire bonds from the environment, while

allowing the pressure signal to be transmitted to the silicon

diaphragm.

The MPX53/MPXV53GC series pressure sensor

operating characteristics and internal reliability and

qualification tests are based on use of dry air as the pressure

media. Media other than dry air may have adverse effects on

sensor performance and long term reliability. Contact the

factory for information regarding media compatibility in your

application.

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Freescale designates the two sides of the pressure sensor

as the Pressure (P1) side and the Vacuum (P2) side. The

Pressure (P1) side is the side containing silicone gel which

isolates the die from the environment. The Freescale MPX

pressure sensor is designed to operate with positive

differential pressure applied, P1 > P2.

The Pressure (P1) side may be identified by using the

following table.

Silicone

Die Coat

Die

P1

P2

Wire Bond

Lead Frame

RTV Die

Bond

Epoxy

Case

Stainless Steel

Metal Cover

Part Number

Case Type

Pressure (P1) Side

Identifier

MPX53D

344

Stainless Steep Cap

MPX53DP

344C

Side with Port Marking

MPX53GP

344B

Side with Port Attached

MPX53GC Series

482A, 482C Side with Port Attached