MPXV4006G

Sensors

Freescale Semiconductor

3

ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION, AND SIGNAL CONDITIONING

The performance over temperature is achieved by

integrating the shear-stress strain gauge, temperature

compensation, calibration and signal conditioning circuitry

onto a single monolithic chip.

Figure 2 illustrates the gauge configuration in the basic

chip carrier (Case 482). A fluorosilicone gel isolates the die

surface and wire bonds from the environment, while allowing

the pressure signal to be transmitted to the silicon diaphragm.

The MPXV4006G series sensor operating characteristics

are based on use of dry air as pressure media. Media, other

than dry air, may have adverse effects on sensor

performance and long-term reliability. Internal reliability and

qualification test for dry air, and other media, are available

from the factory. Contact the factory for information regarding

media tolerance in your application.

Figure 3 shows the recommended decoupling circuit for

interfacing the output of the integrated sensor to the A/D input

of a microprocessor or microcontroller. Proper decoupling of

the power supply is recommended.

Figure 4 shows the sensor output signal relative to

pressure input. Typical, minimum and maximum output

curves are shown for operation over a temperature range of

10

°C to 60°C using the decoupling circuit shown in Figure 3.

The output will saturate outside of the specified pressure

range.

Figure 2. Cross Sectional Diagram SOP

(Not to Scale)

Figure 3. Recommended Power Supply Decoupling

and Output Filtering Recommendations

(For additional output filtering, please refer to

Application Note AN1646.)

Figure 4. Output versus Pressure Differential

Fluorosilicone

Gel Die Coat

Wire

Bond

Differential Sensing

Element

Thermoplastic

Case

Stainless

Steel Cap

Lead

Frame

P1

P2

Die Bond

Die

1.0

µF

IPS

470 pF

OUTPUT

Vs

+5 V

0.01

µFGND

Vout

Max

Min

Differential Pressure (kPa)

See Note 5 in Operating Characteristics

5

4.5

4

3.5

3

2.5

2

1.5

1

0.5

0

03

6

Typical

TEMP = 10 to 60

° C

Transfer Function: