Preliminary Specifications

2.4-2.5 GHz / 4.9-5.8 GHz Dual-Band Power Amplifier

SST13LP05

23

©2006 Silicon Storage Technology, Inc.

S71318-00-000

12/06

FIGURE 24: 16-contact Low-profile, Fine-pitch, Land Grid Array (LFLGA)

SST Package Code: MLC

TABLE

6: Revision History

Revision

Description

Date

00

•

Initial release of data sheet.

Dec 2006

Note: 1. From the bottom view, the pin #1 indicator may be either a 45-degree chamfer or a half-circle notch.

2. The external paddle is electrically connected to the die back-side and should be soldered to the VSS

of the PC board. Connection of this paddle to any other voltage potential will result in shorts and/or

electrical malfunction of the device.

3. Untoleranced dimensions are nominal target values.

4. Land set back from body edge applies to all lands of package.

5. All linear dimensions are in millimeters (max/min).

16-LGA-4x4-MLC-0.0

2.7

Pin #1

2.7

1.40

1.20

Pin #1

Laser

Engraved

TOP VIEW

BOTTOM VIEW

SIDE VIEW

1mm

0.35

0.65 BSC

0.39

4.00

±0.10

4.00

±0.10

See notes

1 and 2

0.075