13

Reflow soldering profile

The Teseo-LIV4F is a high temperature strength surface mount GNSS module supplied on an 18-pin, 6-layer

PCB. The final assembly recommended reflow profiles are indicated here below.

Soldering phase must be executed with care: to avoid undesired melting phenomenon, particular attention has to

be taken on the set up of the peak temperature.

Here below some suggestions about the temperature profile based on the following recommendations.

Table 11. Module soldering profile values

Profile feature

PB-free assembly

Average ramp-up rate (TSMAX to Tp)

3 °C/sec max

Preheat:

- Temperature min (TSmin)

- Temperature max (TSmax)

- Time (tSmin to tSmax) (tS)

150 °C

200 °C

60 ÷ 100 sec

Time maintained above:

- Temperature (TL)

- Time (tL)

217° C

60 ÷ 70 sec

Peak temperature (TP)

245 ± 5 °C

Time within 5 °C of actual peak temperature (TP)

10 ÷ 20 sec

Ramp-down rate (from TP to 100 °C)

1.9 °C/sec

Time from 25 °C to peak temperature

8 minute max.

Figure 3. Module soldering profile graph

13.1

Cooling phase

A controlled cooling avoids negative metallurgical effects of the solder (solder becomes more brittle) and possible

mechanical tensions in the products. Controlled cooling helps to achieve bright solder fillets with a good shape

and low contact angle.

Teseo-LIV4F

Reflow soldering profile

DS13957 - Rev 6

page 19/32