LD9535C

09/21/2020

4

Leadtrend Technology Corporation

www.leadtrend.com.tw

LD9535C-DS-00 September 2020

Absolute Maximum Ratings

Supply Voltage VCC

-0.3V ~ 32V

COMP

-0.3V ~ 12V

FB, CS

-0.3V ~ 7V

DRAIN

-0.3V ~ 650V

Storage Temperature Range

-65

C ~ 150C

Package Thermal Resistance (DIP-8, θJA)

80

C/W

Package Thermal Resistance (DIP-8, θJC)

30

C/W

Power Dissipation (DIP-8, at Ambient Temperature = 85

C)

500mW

Package Thermal Resistance (SOP-8, θJA)

106

C/W

Package Thermal Resistance (SOP-8, θJC)

20

C/W

Power Dissipation (SOP-8, at Ambient Temperature = 85

C)

377mW

Lead temperature (Soldering, 10sec)

260

C

ESD Voltage Protection, Human Body Model (Except Drain Pin)

2.5 KV

ESD Voltage Protection, Human Body Model (Drain Pin)

1 KV

ESD Voltage Protection, Machine Model (Except Drain Pin)

250 V

ESD Voltage Protection, Machine Model (Drain Pin)

200 V

Note1: The value of



JA is measured with the device mounted on 1oz one layer FR-4 board, in a still air environment with TA = 25°C. The

value in any given application depends on the user’s specific board design.

Caution:

Stress exceeding maximum ratings may damage the device. Maximum ratings are stress ratings only. Functional operation above the

recommended operating conditions is not implied. Extended exposure to stress above recommended operating conditions may affect

device reliability.

Recommended Operating Conditions

Item

Min.

Max.

Unit

Operating Junction Temperature

-40

125

C

Supply VCC Voltage

8.0

26.5

V

VCC Capacitor

3.3

10

F

Start-up resistor Value (AC Side, Half Wave)

400K

2M



Comp Pin Capacitor (X7R type)

330

4700

pF

CS Pin Capacitor Value

-

30

pF

Current Sense Resistor

0.25

-

Ω

Note:

1.

It

’s essential to connect VCC pin with a SMD ceramic capacitor (0.1

F ~ 0.47F) to filter out the undesired switching

noise for stable operation. This capacitor should be placed close to IC pin as possible.

2.

It

’s also essential to connect a capacitor to COMP to filter out the undesired switching noise for stable operation.

3.

The small signal components should be placed close to IC pin as possible.