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TDA8005A Datasheet(PDF) 21 Page - NXP Semiconductors

Part # TDA8005A
Description  Low-power 3 V/5 V smart card coupler
PDF  36 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

TDA8005A Datasheet(HTML) 21 Page - NXP Semiconductors

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1998 Mar 20
21
Philips Semiconductors
Preliminary specification
Low-power (3 V/5 V) smart card coupler
TDA8005A
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VDDA
analog supply voltage
−0.3
+6.5
V
VDDD
digital supply voltage
−0.3
+6.5
V
Vn
all input voltages
−0.3
VDD + 0.5 V
In1
DC current into pins XTAL1, XTAL2, RxD,
TxD, RESET, INT1, T0 (port P34), P37,
P00 to P03, P11 to P17, P20 to P23 and
TEST1 to TEST4
−
5mA
In2
DC current from or to pins AUX1 and AUX2
−10
+10
mA
In3
DC current from or to pins S1 to S5
−30
+30
mA
In4
DC current into pin DELAY
−5
+10
mA
In5
DC current from or to pin PRES
−5+5
mA
In6
DC current from and to pins K0 to K5
−5+5
mA
In7
DC current from or into pin ALARM
(according to option choice)
−5+5
mA
Ptot
total power dissipation
Tamb = −25 to +85°C
−
500
mW
Tstg
storage temperature
−55
+150
°C
Vesd
electrostatic discharge
on pins I/O, VCC, RST,
CLK and PRES
−6+6
kV
on other pins
−2+2
kV
Tj
junction temperature
−−
125
°C
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth(j-a)
thermal resistance from junction to ambient in free air
LQFP64
70
K/W
QFP44
60
K/W



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