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TDA8050 Datasheet(PDF) 21 Page - NXP Semiconductors |
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TDA8050 Datasheet(HTML) 21 Page - NXP Semiconductors |
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21 / 24 page ![]() 1999 Dec 14 21 Philips Semiconductors Product specification QPSK transmitter TDA8050 PACKAGE OUTLINE UNIT A max. A1 A2 A3 bp cD(1) E (1) eHE LLp QZ y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm inches 2.65 0.10 0.25 0.01 1.4 0.055 0.3 0.1 2.45 2.25 0.49 0.36 0.27 0.18 20.7 20.3 7.6 7.4 1.27 10.65 10.00 1.2 1.0 0.95 0.55 8 0 o o 0.25 0.1 0.004 0.25 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.1 0.4 SOT287-1 (1) 0.012 0.004 0.096 0.086 0.02 0.01 0.050 0.047 0.039 0.419 0.394 0.30 0.29 0.81 0.80 0.011 0.007 0.037 0.022 0.01 0.01 0.043 0.016 w M bp D HE Z e c v M A X A y 32 17 16 1 θ A A1 A2 L p Q detail X L (A ) 3 E pin 1 index 0 5 10 mm scale SO32: plastic small outline package; 32 leads; body width 7.5 mm SOT287-1 95-01-25 97-05-22 |
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