MCP6541-ESLASHMF datasheet(16/40 Pages) MICROCHIP

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MCP201

DS21730F-page 16

2.3

AC Specifications

TABLE 2-1:

MCP201 THERMAL SPECIFICATIONS

AC Specifications

Electrical Characteristics:

Unless otherwise indicated, all limits are specified for:

VBAT = 6.0V to 18.0V

TAMB = -40°C to +125°C

Symbol

Parameter

Min

Typical

Max

Units

Conditions

Bus Interface

|dV/dt|

Slope Rising and Falling Edges

1.0

2.0

3.0

V/µs

(40% to 60%), No Load

|dV/dt|

Slope Rising and Falling edges

ALTERNATE

2.0

4.0

6.0

V/µs(Note 1), No Load

tTRANSPD

Propagation Delay of Transmitter

—

6.0

stRECPD = max

tRECPD

Propagation Delay of Receiver

—

6.0

s(tRECPDR or tRECPDF)

tRECSYM

Symmetry of Propagation Delay of

Receiver Rising Edge with Respect

to Falling Edge

-2.0

—

2.0

stRECSYM = max

tTRANSSYM

Symmetry of Propagation Delay of

Transmitter Rising Edge with

Respect to Falling Edge

-2.0

—

2.0

stTRANSSYM = max

(tTRANSPDF - tRANSPDR)

Voltage Regulator

tBACTVE

Bus Activity to Voltage Regulator

Enabled

—

Bus debounce time

tVEVR

Voltage Regulator Enabled to

Ready

—50

200

(Note 2)

VREGPOR

Voltage Regulator Enabled to

Ready after POR

——

2.5

(Note 2) CLOAD = 25 nF

tCSOR

Chip Select to Operation Ready

200

(Note 2)

tCSPD

Chip Select to Power-down

—

(Note 2) No CLOAD

tSHUTDOWN Short-Circuit to Shutdown

—

450

—

Characterized but not

tested

tSCREC

Short-Circuit Recovery Time

—

2.0

—

Characterized but not

tested (Note 3)

Note 1:

The mode does not conform to LIN Bus specification version 1.3.

Time depends on external capacitance and load.

Internal current limited. 2.0 ms typical recovery time (RLBUS = 0

Ω, TX = 0.4 VREG, VLBUS = VBAT, TAMB =

25C. Recovery time highly dependent on ambient temperature, package, and thermal resistance).

Sym

Parameter

Min

Typical

Max

Units

Test Conditions

θRECOVERY Recovery Temperature

(junction temperature)

—+135

—

°C

Characterized but not

tested

θSHUTDOWN Shutdown Temperature

(junction temperature)

—+155

—

°C

Characterized but not

tested

tTHERM

Thermal Recovery Time

(after Fault condition removed)

—

2.0

—

Characterized but not

tested (Note 1)

Note 1:

Internal current limited. 2.0 ms typical recovery time (RLBUS = 0

Ω, TX = 0.4 VREG, VLBUS = VBAT, TAMB =

25C. Recovery time highly dependent on ambient temperature, package, and thermal resistance).

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