MCP6541/1R/1U/2/3/4

DS21696E-page 28

© 2006 Microchip Technology Inc.

14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

L

β

c

φ

2

1

D

n

B

p

E1

E

α

A2

A1

A

8°

4°

0°

8°

4°

0°

φ

Foot Angle

β

Mold Draft Angle Bottom

12° REF

α

Mold Draft Angle Top

0.30

0.25

0.19

.012

.010

.007

B

Lead Width

0.20

0.15

0.09

.008

.006

.004

c

Lead Thickness

0.70

0.60

0.50

.028

.024

.020

L

Foot Length

5.10

5.00

4.90

.201

.197

.193

D

Molded Package Length

4.50

4.40

4.30

.177

.173

.169

E1

Molded Package Width

6.50

6.38

6.25

.256

.251

.246

E

Overall Width

0.15

0.10

0.05

.006

.004

.002

A1

Standoff

0.95

0.90

0.85

.037

.035

.033

A2

Molded Package Thickness

1.10

1.05

1.00

.043

.041

.039

A

Overall Height

0.65 BSC

.026 BSC

p

Pitch

14

14

n

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS*

INCHES

Units

Dimensions D and E1 do not include mold fla sh or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side.

Notes:

JEDEC Equivalent: MO-153 AB-1

Revised: 08-17-05

* Controlling Parameter

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tole rance, for information purposes only.

See ASME Y14.5M

See ASME Y14.5M

Drawing No. C04-087

12° REF

12° REF

12° REF