© 2006 Microchip Technology Inc.

DS22011A-page 19

MCP3905A/05L/06A

24-Lead Plastic Shrink Small Outline (SS) (SSOP)

2

1

D

p

n

B

E1

E

L

c

φ

A2

A1

A

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.

INCHES

NOM

* Controlling Parameter

Drawing No. C04-301

JEDEC Equivalent: MO-150

Dimension Limits

Molded Package Thickness

Molded Package Width

Foot Length

Lead Thickness

Foot Angle

Lead Width

Notes:

Number of Pins

Pitch

Overall Height

Standoff

Overall Width

Overall Length

L.025

φ

B

c

.004

.010

0°

Units

E1

D

A1

E

p

A

A2

n

MIN

.066

.002

.301

.205

.318

.068

MILLIMETERS*

NOM

0.65

1.73

7.80

5.30

8.20

0.75

.030

.037

0.63

.006

4°

-

-

.015

8°

0.09

0°

0.25

MAX

.005

.307

.209

.323

24

.026

.073

.068

.311

.212

.328

.008

.078

.070

MIN

1.73

1.68

0.05

7.65

5.20

8.07

0.95

4°

-

0.15

-

0.38

8°

MAX

0.13

1.86

24

7.90

5.38

8.33

0.21

1.99

1.78

Note:

For the most current package drawings, please

see the Microchip Packaging Specification located

at http://www.microchip.com/packaging