MCP1603

DS22042A-page 20

© 2007 Microchip Technology Inc.

5-Lead Plastic Thin Small Outline Transistor (OS) [TSOT]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.

3. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Leads

N

5

Lead Pitch

e

0.95 BSC

Outside Lead Pitch

e1

1.90 BSC

Overall Height

A

–

–

1.10

Molded Package Thickness

A2

0.70

0.90

1.00

Standoff

A1

0.00

–

0.10

Overall Width

E

2.80 BSC

Molded Package Width

E1

1.60 BSC

Overall Length

D

2.90 BSC

Foot Length

L

0.30

0.45

0.60

Footprint

L1

0.60 REF

Foot Angle

φ

0°

4°

8°

Lead Thickness

c

0.08

–

0.20

Lead Width

b

0.30

–

0.50

Mold Draft Angle Top

α

4°

10°

12°

Mold Draft Angle Bottom

β

4°

10°

12°

N

b

E

E1

NOTE 1

D

e1

e

1

2

3

A

A1

A2

c

L1

L

φ

β

α

Microchip Technology Drawing C04-128B