Nexperia

BC55xPAS series

60 V, 1 A NPN medium power transistors

9. Thermal characteristics

Table 6. Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

[1]

-

-

298

K/W

[2]

-

-

154

K/W

[3]

-

-

151

K/W

[4]

-

-

114

K/W

Rth(j-a)

thermal resistance from

junction to ambient

[5]

-

-

76

K/W

Rth(j-sp)

thermal resistance from

junction to solder point

in free air

-

-

20

K/W

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.

[2] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint.

[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 1 cm2.

[4] Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 6 cm2.

[5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and mounting pad for collector 1 cm2.

006aac683

10

1

102

103

Zth(j-a)

(K/W)

10- 1

10- 5

10

10- 2

10- 4

102

10- 1

tp (s)

10- 3

103

1

0

duty cycle = 1

0.01

0.05

0.1

0.2

0.33

0.5

0.75

0.02

0.25

FR4 PCB, single-sided copper, standard footprint

Fig. 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

006aac686

10

1

102

103

Zth(j-a)

(K/W)

10- 1

10- 5

10

10- 2

10- 4

102

10- 1

tp (s)

10- 3

103

1

0

duty cycle = 1

0.01

0.05

0.1

0.2

0.33

0.5

0.75

0.02

0.25

FR4 PCB, 4-layer copper, standard footprint

Fig. 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

BC55XPAS_SER

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Product data sheet

9 October 2024

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