MCP8021 datasheet(13/66 Pages) MICROCHIP

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DS20006265D-page 13

MCP8021/2

2.0

TYPICAL PERFORMANCE CURVES

Note: Unless otherwise indicated: TA = +25°C; Junction Temperature (TJ) is approximated by soaking the device under

test to an ambient temperature equal to the desired junction temperature. The test time is small enough such that the

rise in junction temperature over the ambient temperature is not significant.

FIGURE 2-1: Fault Low to DE2 Message Delay.

FIGURE 2-2: Bootstrap Voltage @ 92% Duty

Cycle.

FIGURE 2-3: Sleep Current vs. Temperature

(MCP8022).

FIGURE 2-4: Driver RDSON vs. Temperature.

FIGURE 2-5:

Auto-Baud vs. Temperature.

Note:

The graphs and tables provided following this note are a statistical summary based on a limited number of

samples and are provided for informational purposes only. The performance characteristics listed herein

are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified

operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

5µs/div

1V/div

10 V/div

10 µs/div

2.1

2.2

2.3

2.4

2.5

2.6

2.7

2.8

2.9

‐40

‐10

110

140

Temperature (°C)

-40

-20

100

120

140

Temperature (°C)

Switch ON

Switch OFF

9000

9100

9200

9300

9400

9500

9600

9700

9800

9900

‐40

‐20

100

120

140

Temperature (°C)

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