21265-PSLASHAP datasheet(1/10 Pages) MITSUBISHI

Part #	21265-P/AP

Description	AC100V~200V three-phase inverter drive for small power motor control.

PDF	10 Pages

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Manufacturer	MITSUBISHI [Mitsubishi Electric Semiconductor]

Direct Link	http://www.mitsubishichips.com

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MITSUBISHI SEMICONDUCTOR <Dual-In-Line Package Intelligent Power Module>

PS21265-P/AP

TRANSFER-MOLD TYPE

INSULATED TYPE

Oct. 2005

PS21265

INTEGRATED POWER FUNCTIONS

600V/20A low-loss 5th generation IGBT inverter bridge for

three phase DC-to-AC power conversion

APPLICATION

AC100V~200V three-phase inverter drive for small power motor control.

Fig. 1 PACKAGE OUTLINES

MITSUBISHI SEMICONDUCTOR <Dual-In-Line Package Intelligent Power Module>

PS21265-P/AP

TRANSFER-MOLD TYPE

INSULATED TYPE

INTEGRATED DRIVE, PROTECTION AND SYSTEM CONTROL FUNCTIONS

• For upper-leg IGBTS :Drive circuit, High voltage high-speed level shifting, Control supply under-voltage (UV) protection.

• For lower-leg IGBTS : Drive circuit, Control supply under-voltage protection (UV), Short circuit protection (SC).

• Fault signaling : Corresponding to an SC fault (Lower-side IGBT) or a UV fault (Lower-side supply).

•Input interface : 3, 5V line compatible. (High Active)

•UL Approved : Yellow Card No. E80276

Dimensions in mm

(Short-pin type : PS21265-P)

Refer Fig. 6 for long-pin type : PS21265-AP.

TERMINAL CODE

1.

UP

2.

VP1

3.

VUFB

4.

VUFS

5.

VP

6.

VP1

7.

VVFB

8.

VVFS

9.

WP

10. VP1

11. VPC

12. VWFB

13. VWFS

14. VN1

15. VNC

16. CIN

17. CFO

18. FO

19. UN

20. VN

21. WN

22. P

23. U

24. V

25. W

26. N

NOTE

Type name , Lot No.

26

25

24

23

22

1

1±0.2

C0.2

(2.5)

0.8±0.2

1±0.2

0.7±0.2

0.8±0.2

0.45±0.2

0.8±0.2

0.45±0.2

C

B

Heat sink side

TERMINAL 22, 26

OTHERS

DETAIL B

(5 pins t = 0.7)

DETAIL C

(21 pins t = 0.7)

TERMINAL 1-2, 20-21

Heat sink side

2

3

4

5

6

7

8

9

10

13

12

15

14

16 17 18 19 20 21

11

20±0.3

10±0.3

79±0.5

(71)

67±0.3

2-

φ4.5±0.2

2.8±0.3

27

×2.8(=75.6)

0.5±0.2

DETAIL D

DETAIL A

D

3.8±0.2

A

Note: All outer lead terminals are with Pb-free solder plating.

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21265-P/AP Datasheet(PDF) 1 Page - Mitsubishi Electric Semiconductor

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