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TMUX1574

SCDS391C – OCTOBER 2018 – REVISED DECEMBER 2019

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Copyright © 2018–2019, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 5

6.1

Absolute Maximum Ratings ...................................... 5

6.2

ESD Ratings.............................................................. 5

6.3

Recommended Operating Conditions ....................... 5

6.4

Thermal Information .................................................. 5

6.5

Electrical Characteristics........................................... 6

6.6

Dynamic Characteristics ........................................... 7

6.7

Timing Requirements ................................................ 8

6.8

Typical Characteristics .............................................. 9

7

Parameter Measurement Information ................ 14

7.1

On-Resistance ........................................................ 14

7.2

Off-Leakage Current ............................................... 14

7.3

On-Leakage Current ............................................... 15

7.4

IPOFF Leakage Current ............................................ 15

7.5

Transition Time ....................................................... 16

7.6

tON (EN) and tOFF (EN) Time....................................... 16

7.7

tON (VDD) and tOFF (VDD) Time................................... 17

7.8

Break-Before-Make Delay....................................... 17

7.9

Propagation Delay................................................... 18

7.10

Skew ..................................................................... 18

7.11

Charge Injection .................................................... 19

7.12

Capacitance .......................................................... 19

7.13

Off Isolation ........................................................... 20

7.14

Channel-to-Channel Crosstalk .............................. 20

7.15

Bandwidth ............................................................. 21

8

Detailed Description ............................................ 22

8.1

Overview ................................................................. 22

8.2

Functional Block Diagram ....................................... 22

8.3

Feature Description................................................. 22

8.4

Device Functional Modes........................................ 24

8.5

Truth Tables ............................................................ 24

9

Application and Implementation ........................ 25

9.1

Application Information............................................ 25

9.2

Typical Application ................................................. 25

10

Power Supply Recommendations ..................... 26

11

Layout................................................................... 27

11.1

Layout Guidelines ................................................. 27

11.2

Layout Example .................................................... 28

12

Device and Documentation Support ................. 29

12.1

Documentation Support ........................................ 29

12.2

Receiving Notification of Documentation Updates 29

12.3

Community Resources.......................................... 29

12.4

Trademarks ........................................................... 29

12.5

Electrostatic Discharge Caution ............................ 29

12.6

Glossary ................................................................ 29

13

Mechanical, Packaging, and Orderable

Information ........................................................... 30

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision B (September 2019) to Revision C

Page

•

Added prop delay and skew specs for DYY package ........................................................................................................... 8

•

Changed Figure 20 to include prop. delay and skew for DYY package .............................................................................. 12

Changes from Revision A (December 2018) to Revision B

Page

•

Added the SOT-23-THIN (DYY) package to the data sheet .................................................................................................. 1

•

Added thermal information for DYY package. ........................................................................................................................ 5

Changes from Original (October 2018) to Revision A

Page

•

Changed the document status From: Advanced Information To: Production data ................................................................ 1