Applications

The HSON8 is suitable for medium-power applications (reference values

80W*/60A), designed for low on-resistance and high-speed switching

MOSFETs. Ideal for:

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Motor drivers

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Injection drivers

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Power supply circuits

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Lamp drivers

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Automotive products

*Tc = 25°C, Tj = Max 150°C

Reliability Qualification

Amkor packages are assembled with proven reliable semiconductor

materials. All reliability testing includes:

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JEDEC standard pre-conditioning except high temperature storage

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85°C/85% RH, 168 hours, IR reflow 260°C 3X

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H3TRB: 85°C/85% RH, 1000 hours

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uHAST: 130°C/85% RH, 96 hours

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Temp cycle: -55°C to 150°C, 1000 cycles

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High temp storage: 150°C, 1000 hours

Test Services

Amkor offers full turnkey business for all power discrete products with

the capability to test various types of power devices including MOSFETs,

intelligent power devices, etc.

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Power discrete test capability

▷ DC

▷ Capacitance *1

▷ Rg *1

▷ Avalanche test

▷ Thermal resistance

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Program conversion

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Electrical failure analysis

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Integrated test, marking, vision inspection and tape & reel services

*1 Sampling test only

The HSON8 package maintains the same footprint area (5 x 6 mm) as

the standard SOP8 package. HSON8 features an exposed die pad to

enhance thermal performance.

HSON8

DATA SHEET | POWER PRODUCTS

FEATURES

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Al wirebonding

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Full turnkey available from wafer saw

through test and packing

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Green materials: Pb-free plating &

halogen-free mold compound

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Plating coverage at the tip of the

lead is more than 50% of leadframe

thickness

UNDER DEVELOPMENT

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Environmentally friendly die attach

Pb-free solder

PROCESS HIGHLIGHTS

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Interconnect: φ125 µm ~ φ300 µm

Al wire

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Plating: 100% Matte Sn

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Marking: Laser mark