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Cross Sections

Die Up

SOT-23/TSOT

Die Down

Configuration Options

SOT-23/TSOT Nominal Package Dimensions (mm)

Package

Type

Lead

Count

Body

Width

Body

Length

Body

Thickness

Overall

Height

Lead

Pitch

Tip-to-Tip

JEDEC/EIAJ

SOT‑23

3

1.3

2.9

0.90

0.98

0.95/1.9

2.40

SOT346/

TO‑236/SC‑59

4

1.3

2.9

0.90

0.98

1.92

2.40

SOT143/

TO‑253

5

1.6

2.9

1.15

1.23

0.95/1.9

2.80

MO‑178

6

1.6

2.9

1.15

1.23

0.95

2.80

MO‑178

8

1.6

2.9

1.15

1.23

0.65

2.80

MO‑178

TSOT*

3

1.6

2.9

0.88

0.96

0.95/1.9

2.75

N/A

5

1.6

2.9

0.88

0.96

0.95

2.75

MO‑193

6

1.6

2.9

0.88

0.96

0.95

2.75

MO‑193

8

1.6

2.9

0.88

0.96

0.65

2.75

MO‑193

*TSOT may also be referenced as a TSOP

Cu leadframe

Wirebond

Die

A

B

Die attach adhesive

Reduced pad

Mold compound

C

D

E

F

Cu leadframe

Die attach adhesive

Mold compound

A

B

Reduced pad

Die

Wirebond

C

D

E

F

B

A

F

E

D

C

A

C

B

D

E

F