TISP7125F3, TISP7150F3, TISP7180F3, TISP7240F3, TISP7260F3,

TISP7290F3, TISP7320F3, TISP7350F3, TISP7380F3

TRIPLE BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS

24

MARCH 1994 - REVISED MARCH 2000

P R OD UCT

INFORM A T ION

MECHANICAL DATA

SL003

3-pin plastic single-in-line package

This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic

compound. The compound will withstand soldering temperature with no deformation, and circuit performance

characteristics will remain stable when operated in high humidity conditions. Leads require no additional

cleaning or processing when used in soldered assembly.

ALL LINEAR DIMENSIONS IN MILLIMETERS AND PARANTHETICALLY IN INCHES

2,54 (0.100) Typical

(see Note A)

2Places

8,31 (0.327)

MAX

SL003

4,267 (0.168)

MIN

1,854 (0.073)

MAX

0,711 (0.028)

0,559 (0.022)

3Places

12,9 (0.492)

MAX

6,60 (0.260)

6,10 (0.240)

2

1

3

0,356 (0.014)

0,203 (0.008)

3,40 (0.134)

3,20 (0.126)

9,75 (0.384)

9,25 (0.364)

NOTES: A. Each pin centreline is located within 0,25 (0.010) of its true longitudinal position.

B. Body molding flash of up to 0,15 (0.006) may occur in the package lead plane.

C. Details of the previous dot index SL003 style, drawing reference MDXXAD, are given in the earlier publications.

MDXXCE

Index

Notch