AMC7585-ADJSJ datasheet(7/10 Pages) ADDTEK

VOUT(NOM) = the nominal output voltage

IOUT(NOM) = the nominal output current, and

IQ = the quiescent current the regulator consumes at IOUT(MAX)

VIN(MAX) = the maximum input voltage

Thermal consideration:

The AMC7585 series have internal power and thermal limiting circuitry designed to protect the device under

overload conditions. However maximum junction temperature ratings should not be exceeded under continuous normal

load conditions. The thermal protection circuit of AMC7585 series will prevent the device from damage due to

excessive power dissipation. When the device temperature rises to approximately 150 °C, the regulator will be turned

off.

When power consumption is over about 1.2W (for TO-220/ TO-263 package, 687mW for TO-252 package, at

TA=70 °C), additional heat sink is required to control the junction temperature below 125 °C.

The junction temperature is: TJ = PD (θJT + θTS + θSA ) + TA

P D : Dissipated power.

JT : Thermal resistance from the junction to the mounting tab of the package.

(For TO-220, TO-263, and TO-263-3 packages,

JT=6 °C /W. For TO-252 package, θJT=7°C /W)

TS : Thermal resistance through the interface between the IC and the surface on which it is mounted.

(typically,

CS < 1.0 °C / W)

SA : Thermal resistance from the mounting surface to ambient (thermal resistance of the heat sink).

If PC Board copper is going to be used as a heat sink, below table can be used to determine the appropriate size of

copper foil required. For multi-layered PCB, these layers can also be used as a heat sink. They can be connected with

several through hole vias.

PCB

SA (°C / W )

PCB heat sink size (mm

500

1000

1500

2000

3000

4000

5000

Recommended figure of PCB area used as a heat sink.

through hole vias

(Top View)

(Bottom View)

AMC7585-ADJSJ Datasheet(PDF) 7 Page - ADDtek Corp

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