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DS20005208B-page 21

MCP1643

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

1.

2.

Pin 1 visual index feature may vary, but must be located within the hatched area.

Dimensioning and tolerancing per ASME Y14.5M

Sheet 2 of 2

C

SEATING

PLANE

H

Number of Terminals

Overall Height

Terminal Width

Overall Width

Terminal Length

Molded Package Width

Molded Package Thickness

Pitch

Standoff

Units

Dimension Limits

A1

A

b

E1

A2

e

L

E

N

0.65 BSC

0.85

0.40

0.22

–

0.00

–

0.60

–

–

MILLIMETERS

MIN

NOM

8

0.80

0.40

1.10

0.15

MAX

L1

0.95 REF

Footprint

Overall Length

D

3.00 BSC

Terminal Thickness

c

0.08–0.23

R

R1

1

–

0.07

–

Lead Bend Radius

–

0.07

–

Lead Bend Radius

–

0°

8°

Foot Angle

–

5°

15°

Mold Draft Angle

0.75

0.95

4.90 BSC

3.00 BSC

DETAIL B

c

4X 1

4X 1

L

(L1)

R

R1

3.

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or

protrusions shall not exceed 0.15mm per side.

8-Lead Plastic Micro Small Outline Package (MS) - 3x3 mm Body [MSOP]

Microchip Technology Drawing C04-111-MS Rev F