2

Package Dimensions

Parameter

AlInGaP

InGaN

GaP

Units

20

10

20

mA

Power Dissipation

48

38

52

mW

Reverse Voltage

5

5

5

V

LED Junction Temperature

95

95

95

˚C

Operating Temperature Range

–30 to +85

˚C

Storage Temperature Range

–40 to +85

˚C

Soldering Temperature

See reflow soldering profile (Figure 6 & 7)

Note:

1. Derate linearly as shown in Figure 4.

NOTES:

1. ALL DIMENSIONS IN MILLIMETERS (INCHES).

2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.

1.6

(0.063 )

0.16 (0.006)

0.5 (0.020)

0.4

(0.016)

LED DIES

DIFFUSED EPOXY

PC BOARD

SOLDERING

TERMINALS

0.8 (0.031)

CATHODE LINE

0.3 (0.012)

CATHODE LINE

1

2

3

4

POLARITY

1

3

HSMF-C162

AMBER

2

4

RED

HSMF-C163

GREEN

RED

HSMF-C164

BLUE

RED

HSMF-C165

GREEN

RED

HSMF-C166

GREEN

YELLOW

HSMF-C167

GREEN

ORANGE

HSMF-C168

BLUE

GREEN

HSMF-C169

BLUE

AMBER