THERMAL METRIC(1)

UNIT

PW (TSSOP)

14 PINS

ΨJB

Junction-to-board characterization parameter

100.7

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

5.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

VCC

TA = 25°C

-40°C to 125°C

UNIT

MIN

TYP

MAX

MIN

TYP

MAX

VOH

IOH = -50µA

4.5V

4.4

4.49

4.4

V

5.5V

5.4

5.49

5.4

IOH = -24mA

4.5V

3.94

3.7

IOH = -24mA

5.5V

4.86

4.7

IOH = -50mA

5.5V

3.85

IOH = -75mA

5.5V

3.85

VOL

IOH = 50µA

4.5V

0.001

0.1

0.1

V

5.5V

0.001

0.1

0.1

IOH = 24mA

4.5V

0.36

0.5

IOH = 24mA

5.5V

0.36

0.5

IOH = 50mA

5.5V

1.65

IOH = 75mA

5.5V

1.65

II

VI = 5.5V or GND

0V to 5.5V

±0.1

±1

µA

ICC

VI = VCC or GND, IO = 0

5.5V

2

80

µA

ΔICC

VI = VCC – 2.1V; Any Input

4.5V to 5.5V

0.6

1.2

1.5

mA

CI

VI = VCC or GND

5V

8

pF

CPD (1) (2)

CL = 50pF, F = 1MHz

5V

14

pF

(1)

CPD is used to determine the dynamic power consumption, per channel

(2)

PD= VCC 2xFIx(CPD+ CL) where FI= input frequency, CL= output load capacitance, VCC= supply voltage

5.6 Switching Characteristics

CL = 50pF; over operating free-air temperature range; typical values measured at TA = 25°C (unless otherwise noted). See

Parameter Measurement Information.

PARAME

TER

FROM (INPUT)

TO (OUTPUT)

VCC

TA = 25°C

-40°C to 125°C

UNIT

MIN

TYP

MAX

MIN

TYP

MAX

tPLH

A or B

Y

5V

1

6.5

9

1

10

ns

tPHL

5V

1

6.5

9

1

10

ns

tr

Y

5V

2.4

3.9

3

4.6

ns

tf

5V

2.3

3.4

2.6

4.1

ns

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SN74ACT08-Q1

SCAS993A – MARCH 2024 – REVISED DECEMBER 2024

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