www.irf.com

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iP2003APbF

Refer to the following application notes for detailed guidelines and suggestions when

implementing iPOWIR Technology products:

AN-1030: Applying iPOWIR Products in Your Thermal Environment

This paper explains how to use the Power Loss and SOA curves in the data sheet to validate if the operat-

ing conditions and thermal environment are within the Safe Operating Area of the iPOWIR product.

AN-1047: Graphical solution for two branch heatsinking Safe Operating Area

Detailed explanation of the dual axis SOA graph and how it is derived.

AN-1028: Recommended Design, Integration and Rework Guidelines for International Rectifier’s

BGA and LGA Packages

This paper discusses optimization of the layout design for mounting iPowIR BGA and LGA packages on

printed circuit boards, accounting for thermal and electrical performance and assembly considerations .

Topics discussed includes PCB layout placement, routing, and via interconnect suggestions, as well as

soldering, pick and place, reflow, cleaning and reworking recommendations.

AN-1029a: Optimizing a PCB Layout for an iPowir Technology Design

IRDCiP2003A : Reference design for iP2003APbF

Fig. 12: Tape & Reel Information

1. OUTLINE CONFORMS TO EIA-481 & EIA-541.

iP2003A, LGA

NOTES:

12mm

FEED DIRECTION

24mm

0508

iP2003A

6B7D

iP2003A

6B7D

0508

iP2003APbF, LGA

iP2003AP

iP2003AP

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