The Embedded I/O Company

Technical Information

 Form Factor: PCI Express x1, Revision 3.0

 Board size: approx. 143mm x 111mm

 One XMC Slot:

 PCIe Interface: x1, Rev. 3.0

 XMC Front Panel I/O

 All XMC Power Supplies generated from +12V

 TPCE277-1xR: +12V from PCIe edge card

connector

 TPCE277-2xR: +12V from PCIe Graphics Power

Connector

 JTAG:

 10-pin header with all five JTAG signals routed to

XMC connector

 Operating temperature: -40°C to +85°C

 MTBF (MIL-HDBK217F/FN2 GB 20°C):

TPCE277-10R: 1764000h

TPCE277-11R: 1631000h

TPCE277-20R: 1288000h

TPCE277-21R: 1216000h

Order Information

RoHS Compliant

TPCE277-10R

1 Slot XMC Carrier, PCIe x1, VPWR = 12V, 12V from PCIe connector

TPCE277-11R

1 Slot XMC Carrier, PCIe x1, VPWR = 5V, 12V from PCIe connector

TPCE277-20R

1 Slot XMC Carrier, PCIe x1, VPWR = 12V, 12V from PCIe Graphics connector

TPCE277-21R

1 Slot XMC Carrier, PCIe x1, VPWR = 5V, 12V from PCIe Graphics connector

For the availability of non-RoHS compliant (leaded solder) products please contact TEWS.

Documentation

TPCE277-DOC

User Manual

TEWS TECHNOLOGIES GmbH keeps the right to change technical specification without further notice.

All trademarks mentioned are property of their respective owners.

Issue 1.0.2

2017-08-31

TEWS TECHNOLOGIES GmbH

Am Bahnhof 7

25469 Halstenbek, Germany

Phone: +49 (0) 4101 4058 0

Fax: +49 (0) 4101 4058 19

e-mail: info@tews.com

www.tews.com