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TDA7265SA Datasheet(PDF) 8 Page - STMicroelectronics |
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TDA7265SA Datasheet(HTML) 8 Page - STMicroelectronics |
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8 / 12 page ![]() TDA7265SA 8/12 Figure 16. SVR vs. Frequency Figure 17. Attenuation vs. Pin #5 Voltage Figure 18. Power Dissipation vs. Output Power Figure 19. Power Dissipation vs. Output Power 6 HEAT SINK DIMENSIONING: In order to avoid the thermal protection intervention, that is placed approximatively at Tj = 150°C, it is im- portant the dimensioning of the Heat Sinker RTh (°C/W). The parameters that influence the dimensioning are: – Maximum dissipated power for the device (Pdmax) – Max thermal resistance Junction to case (RTh j-c) – Max. ambient temperature Tamb max – Quiescent current Iq (mA) Example: VCC = ±17.5V, Rload = 8ohm, RTh j-c = 3 °C/W , Tamb max = 50°C Pdmax = (N° channels) · 2V cc 2 Π 2 R load ⋅ -------------------------- I q V cc ⋅ + |
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