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HGTP3N60C3D Datasheet(PDF) 1 Page - Harris Corporation |
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HGTP3N60C3D Datasheet(HTML) 1 Page - Harris Corporation |
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1 / 11 page ![]() SEMICONDUCT OR 1 HGTP3N60C3D, HGT1S3N60C3D, HGT1S3N60C3DS 6A, 600V, UFS Series N-Channel IGBT with Anti-Parallel Hyperfast Diode Features • 6A, 600V at TC = +25 oC • 600V Switching SOA Capability • Typical Fall Time - 130ns at TJ = +150 oC • Short Circuit Rating • Low Conduction Loss • Hyperfast Anti-Parallel Diode Description The HGTP3N60C3D, HGT1S3N60C3D, and HGT1S3N60C3DS are MOS gated high voltage switching devices combining the best features of MOSFETs and bipolar transistors. These devices have the high input impedance of a MOSFET and the low on-state conduction loss of a bipolar transistor. The much lower on-state voltage drop varies only moderately between +25oC and +150oC. The IGBT used is the development type TA49113. The diode used in anti-parallel with the IGBT is the development type TA49055. The IGBT is ideal for many high voltage switching applications operating at moderate frequencies where low conduction losses are essential. Packaging JEDEC TO-220AB JEDEC TO-262AA JEDEC TO-263AB Terminal Diagram N-CHANNEL ENHANCEMENT MODE Absolute Maximum Ratings TC = +25oC, Unless Otherwise Specified PACKAGING AVAILABILITY PART NUMBER PACKAGE BRAND HGTP3N60C3D TO-220AB G3N60C3D HGT1S3N60C3D TO-262AA G3N60C3D HGT1S3N60C3DS TO-263AB G3N60C3D NOTE: When ordering, use the entire part number. Add the suffix 9A to obtain the TO-263AB variant in tape and reel, i.e. HGT1S3N60C3DS9A. Formerly Developmental Type TA49119. GATE COLLECTOR (FLANGE) EMITTER COLLECTOR EMITTER COLLECTOR GATE COLLECTOR (FLANGE) A M COLLECTOR (FLANGE) GATE EMITTER C E G HGTP3N60C3D, HGT1S3N60C3D HGT1S3N60C3DS UNITS Collector-Emitter Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .BVCES 600 V Collector Current Continuous At TC = +25 oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I C25 6A At TC = +110 oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I C110 3A Collector Current Pulsed (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ICM 24 A Gate-Emitter Voltage Continuous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGES ±20 V Gate-Emitter Voltage Pulsed. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGEM ±30 V Switching Safe Operating Area at TJ = +150 oC, Fig. 14. . . . . . . . . . . . . . . . . . . . . SSOA 18A at 480V Power Dissipation Total at TC = +25 oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P D 33 W Power Dissipation Derating TC > +25 oC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.27 W/oC Operating and Storage Junction Temperature Range . . . . . . . . . . . . . . . . . . . . TJ, TSTG -40 to +150 oC Maximum Lead Temperature for Soldering. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL 260 oC Short Circuit Withstand Time (Note 2) at VGE = 10V, Fig 6 . . . . . . . . . . . . . . . . . . . . .tSC 8 µs NOTE: 1. Repetitive Rating: Pulse width limited by maximum junction temperature. 2. VCE(PK) = 360V, TJ = +125 oC, R GE = 82Ω. May 1996 CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper ESD Handling Procedures. Copyright © Harris Corporation 1996 File Number 4140 |
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