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EXAMPLE STENCIL DESIGN

14X (1.5)

14X (0.45)

(2.56)

(2.55)

BASED ON

0.125 THICK

STENCIL

12X (0.65)

(R0.05) TYP

(5.8)

4223314/A 09/2016

PowerPAD

TSSOP - 1.2 mm max height

PWP0014G

PLASTIC SMALL OUTLINE

2.16 X 2.16

0.175

2.34 X 2.33

0.15

2.56 X 2.55 (SHOWN)

0.125

2.86 X 2.85

0.1

SOLDER STENCIL

OPENING

STENCIL

THICKNESS

NOTES: (continued)

10. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

11. Board assembly site may have different recommendations for stencil design.

TM

SYMM

SYMM

1

7

8

14

BASED ON

0.125 THICK

STENCIL

BY SOLDER MASK

METAL COVERED

SEE TABLE FOR

DIFFERENT OPENINGS

FOR OTHER STENCIL

THICKNESSES

SOLDER PASTE EXAMPLE

EXPOSED PAD

100% PRINTED SOLDER COVERAGE BY AREA

SCALE:10X

15

SN74ACT08-Q1

SCAS993B – MARCH 2024 – REVISED FEBRUARY 2025

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