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EXAMPLE STENCIL DESIGN

14X (0.6)

14X (0.25)

10X (0.5)

(2.3)

(2.8)

(1.38)

(0.95)

(R0.05) TYP

WQFN - 0.8 mm max height

BQA0014B

PLASTIC QUAD FLATPACK - NO LEAD

4227062/B 09/2021

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

SOLDER PASTE EXAMPLE

BASED ON 0.125 MM THICK STENCIL

SCALE: 20X

EXPOSED PAD 15

87% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE

SYMM

SYMM

2

6

7

8

9

13

14

1

15