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Date 12/01/2024 | Page 4 of 6

BEL | SERIES: F2D1-2012A | DESCRIPTION: HIGH CURRENT POWER INDUCTORS

PERFORMANCE CURVES (CONTINUED)

REFLOW SOLDERING TEMPERATURE CURVE

T (s)

25

150

200

255

T (°C)

217

Preheat Area

60~120s

Time 25ºC to peak: 480s max

Max. Ramp up rate = 3ºC/s

Max. Ramp down rate = 6ºC/s

20~30

60~150s

T(s) max 200ºC

CLASSIFICATION OF PEAK PACKAGE BODY TEMPERATURE

Package Thickness

Package Volume

< 350 mm3

350

~ 2000 mm3

> 2000 mm3

PB-Free Assembly

< 1.6 mm

260

°C

260

°C

260

°C

1.6

~ 2.5 mm

260

°C

250

°C

245

°C

≥ 2.5 mm

250

°C

245

°C

245

°C