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CSD95485RWJ Datasheet(PDF) 9 Page - Texas Instruments |
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CSD95485RWJ Datasheet(HTML) 9 Page - Texas Instruments |
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9 / 12 page ![]() .000 PKG 0 ( ) 2.9 ( ) 2.25 ( ) 2.05 ( ) 1.275 ( ) 0.5 ( ) 0.3 ( ) 0.3 5X ( ) 1.15 5X ( ) 2 ( ) 2.6 ( ) TYP 3.2 ( ) 0.025 ( ) 2.2 ( ) 0.8 ( ) 0.4 ( ) 0.1 ( ) 0.3 ( ) 2.25 16X (0.6) 16X (0.25) 14X (0.45) 19X (0.45) ( ) 1.05 ( ) 2.05 ( ) 2.175 ( ) TYP 2.75 20X (0.25) (R0.05) TYP (0.05) MIN TYP ( 0.2) VIA TYP 7 PKG METAL UNDER SOLDER MASK TYP SOLDER MASK OPENING, TYP 1 6 9 10 19 20 24 25 29 30 39 40 41 9 CSD95485RWJ www.ti.com SLPS721 – MARCH 2020 Submit Documentation Feedback Copyright © 2020, Texas Instruments Incorporated 9.2 Recommended PCB Land Pattern 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This package is designed to be soldered to thermal pads on the board. For more information, see QFN/SON PCB Attachment (SLUA271). |
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