bq30z554-R1

SLUSBD4 – OCTOBER 2013

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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERING INFORMATION

ORDERING INFORMATION(1)

PACKAGE

PACKAGE

TA

PART NUMBER

PACKAGE

DESIGNATOR

MARKING

TUBE(2)

TAPE AND REEL(3)

–40°C to 85°C

bq30z554-R1

TSSOP–30

DBT

bq30z554-R1

bq30z554DBT-R1

bq30z554DBTR-R1

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of the document, or see the TI

website at www.ti.com.

(2)

A single tube quantity is 50 units.

(3)

A single reel quantity is 2000 units.

THERMAL INFORMATION

bq30z554-R1

THERMAL METRIC(1)

TSSOP

UNITS

30 PINS

θJA, High K

Junction-to-ambient thermal resistance(2)

73.1

θJC(top)

Junction-to-case(top) thermal resistance (3)

17.5

θJB

Junction-to-board thermal resistance (4)

34.5

°C/W

ψJT

Junction-to-top characterization parameter (5)

0.3

ψJB

Junction-to-board characterization parameter (6)

30.3

θJC(bottom)

Junction-to-case(bottom) thermal resistance (7)

n/a

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as

specified in JESD51-7, in an environment described in JESD51-2a.

(3)

The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-

standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(4)

The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB

temperature, as described in JESD51-8.

(5)

The junction-to-top characterization parameter,

ψJT, estimates the junction temperature of a device in a real system and is extracted

from the simulation data for obtaining

θJA, using a procedure described in JESD51-2a (sections 6 and 7).

(6)

The junction-to-board characterization parameter,

ψJB, estimates the junction temperature of a device in a real system and is extracted

from the simulation data for obtaining

θJA , using a procedure described in JESD51-2a (sections 6 and 7).

(7)

The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific

JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

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