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EXAMPLE BOARD LAYOUT

0.07 MIN

ALL AROUND

0.07 MAX

ALL AROUND

24X (0.25)

24X (0.6)

(

) TYP

VIA

0.2

20X (0.5)

(3.8)

(3.8)

(1.05)

( 2.6)

(R

)

TYP

0.05

(1.05)

WQFN - 0.8 mm max height

RTW0024A

PLASTIC QUAD FLATPACK - NO LEAD

4222815/A 03/2016

SYMM

1

6

7

12

13

18

19

24

SYMM

LAND PATTERN EXAMPLE

SCALE:15X

25

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

SOLDER MASK

DEFINED

METAL

SOLDER MASK

OPENING

SOLDER MASK DETAILS

NON SOLDER MASK

DEFINED

(PREFERRED)