LED

GND

GNDT

CTRL

VDD

ISET

A

B

C

2

1

LED

GND

GNDT

CTRL

VDD

ISET

A

B

C

2

1

LP5522

SNVS488A – JUNE 2007 – REVISED MARCH 2013

www.ti.com

Connection Diagrams

DSBGA-6 package, 0.815 x 1.215 x 0.60 mm body size, 0.4 mm pitch, Package Number YFQ0006

Figure 1. Top View

Figure 2. Bottom View

PIN DESCRIPTIONS(1)

Pin

Name

Type

Description

A1

VDD

P

Power supply pin

B1

ISET

AI

Current set input

C1

CTRL

DI

Digital control input

A2

LED

AO

Current source output

B2

GND

G

Ground

C2

GNDT

G

Ground

(1)

A: Analog Pin, D: Digital Pin, G: Ground Pin, P: Power Pin, I: Input Pin, O: Output Pin

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2) (3)

V (VDD, LED, ISET)

-0.3V to +6.0V

Voltage on logic pin (CTRL)

-0.3V to VDD +0.3V

with 6.0V max

Continuous Power Dissipation (4)

Internally Limited

Junction Temperature (TJ-MAX)

125°C

Storage Temperature Range

-65°C to +150°C

Maximum Lead Temperature (Reflow soldering, 3 times)

260°C

(5)

ESD Rating (6)

Human Body Model

2 kV

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits

and associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pins.

(3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Office/ Distributors for availability and

specifications.

(4)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=160°C (typ.) and

disengages at TJ=140°C (typ.).

(5)

For detailed soldering specifications and information, please refer to Application Note AN1112 : DSBGA Wafer Level Chip Scale

Package SNVA009.

(6)

The Human body model is a 100 pF capacitor discharged through a 1.5 k

Ω resistor into each pin. MIL-STD-883 3015.7

2

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