SFH 9201

2004-09-23

9

Bitte Verarbeitungshinweise für SMT-Bauelemente beachten!

Please observe the handling guidelines for SMT devices!

IR-Reflow Lötprofil

(nach IPC 9501)

IR Reflow Soldering Profile

(acc. to IPC 9501)

Löthinweise

Soldering Conditions

Bauform

Type

Drypack

Level acc.

to

IPS-stand.

020

Tauch-, Schwalllötung

Dip, Wave Soldering

Reflowlötung

Reflow Soldering

Kolbenlötung

Iron Soldering

Peak Temp.

(solderbath)

Max. Time in

Peak Zone

Peak Temp.

(package

temp.)

Max. Time

in Peak

Zone

(Iron temp.)

SFH 9201

4

n. a.

–

245

°C

10 sec.

n.a.

OHLY0597

0

0

50

100

150

200

2

50

100

150

200

250

300

T

t

C

s

240-245 C

10-40 s

183 C

120 to 180 s

defined for Preconditioning: up to 6 K/s

ramp-down rate up to 6 K/s

ramp-up rate up to 6 K/s

defined for Preconditioning: 2-3 K/s