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DCTPACKAGE

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DCUPACKAGE

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YZP PACKAGE

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1

V

CC

8

OE

2

7

A

Y

3

6

B

D

4

5

GND

C

3

6

D

B

8

1

V

CC

OE

5

GND

4

C

2

7

Y

A

GND

5

4

C

3 6

D

B

2 7

Y

A

8

V

CC

1

OE

SN74LVC1G99

www.ti.com

SCES609G – SEPTEMBER 2004 – REVISED NOVEMBER 2013

Ultra-Configurable Multiple-Function Gate With 3-State Output

Check for Samples: SN74LVC1G99

1

FEATURES

DESCRIPTION

The SN74LVC1G99 device is operational from 1.65 V

2

•

Available in Texas Instruments

to 5.5 V.

NanoFree™ Package

The SN74LVC1G99 device features configurable

•

Supports 5-V VCC Operation

multiple functions with a 3-state output. The output is

•

Inputs Accept Voltages to 5.5 V

disabled when the output-enable (OE) input is high.

•

Supports Down Translation to VCC

When OE is low, the output state is determined by 16

patterns of 4-bit input. The user can choose logic

•

Max tpd of 6.7 ns at 3.3 V

functions, such as MUX, AND, OR, NAND, NOR,

•

Low Power Consumption, 10-µA Max ICC

XOR, XNOR, inverter, and buffer. All inputs can be

•

±24-mA Output Drive at 3.3 V

connected to VCC or GND.

•

Offers Nine Different Logic Functions in a

This device functions as an independent inverter, but

Single Package

because of Schmitt action, it has different input

•

Ioff Supports Live Insertion, Partial-Power-

threshold levels for positive-going (VT+) and negative-

Down Mode, and Back-Drive Protection

going (VT–) signals.

•

Input Hysteresis Allows for Slow Input

To ensure the high-impedance state during power up

Transition Time and Better Noise Immunity at

or power down, OE should be tied to VCC through a

Input

pullup resistor; the minimum value of the resistor is

determined by the current-sinking capability of the

•

Latch-Up Performance Exceeds 100 mA Per

driver.

JESD 78, Class II

This device is fully specified for partial-power-down

•

ESD Protection Exceeds JESD 22

applications using Ioff. The Ioff circuitry disables the

–

2000-V Human-Body Model (A114-A)

outputs,

preventing

damaging

current

backflow

–

200-V Machine Model (A115-A)

through the device when it is powered down.

–

1000-V Charged-Device Model (C101)

NanoFree™

package

technologies

are

a

major

breakthrough in IC packaging concepts, using the die

as the package.

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2

NanoFree is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 2004–2013, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.