SN74LVC2G08

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SCES198N – APRIL 1999 – REVISED DECEMBER 2015

6.3 Recommended Operating Conditions

(1)

MIN

MAX

UNIT

Operating

1.65

5.5

VCC

Supply voltage

V

Data retention only

1.5

VCC = 1.65 V to 1.95 V

0.65 × VCC

VCC = 2.3 V to 2.7 V

1.7

VIH

High-level input voltage

V

VCC = 3 V to 3.6 V

2

VCC = 4.5 V to 5.5 V

0.7 × VCC

VCC = 1.65 V to 1.95 V

0.35 × VCC

VCC = 2.3 V to 2.7 V

0.7

VIL

Low-level input voltage

V

VCC = 3 V to 3.6 V

0.8

VCC = 4.5 V to 5.5 V

0.3 × VCC

VI

Input voltage

0

5.5

V

VO

Output voltage

0

VCC

V

VCC = 1.65 V

–4

VCC = 2.3 V

–8

IOH

High-level output current

–16

mA

VCC = 3 V

–24

VCC = 4.5 V

–32

VCC = 1.65 V

4

VCC = 2.3 V

8

IOL

Low-level output current

16

mA

VCC = 3 V

24

VCC = 4.5 V

32

VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V

20

Δt/Δv

Input transition rise or fall rate

VCC = 3.3 V ± 0.3 V

10

ns/V

VCC = 5 V ± 0.5 V

5

SN74LVC2G08DCU

–40

125

TA

Operating free-air temperature

SN74LVC2G08DCT

–40

125

°C

SN74LVC2G08YZP

–40

85

(1)

All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

6.4 Thermal Information

SN74LVC2G08

THERMAL METRIC(1)

DCT (SM8)

DCU (VSSOP)

YZP (DSBGA)

UNIT

8 PINS

8 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

220

227

128

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

108

84

14

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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