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LSV196 Datasheet(PDF) 1 Page - OSRAM GmbH |
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LSV196 Datasheet(HTML) 1 Page - OSRAM GmbH |
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1 / 14 page  LG V196, LO V196, LS V196, LY V196 FIREFLY ® Hyper-Bright LED Lead (Pb) Free Product - RoHS Compliant Vorläufige Daten / Preliminary Data 2006-07-03 1 Besondere Merkmale • Gehäusetyp: SMT Gehäuse, farbloser diffuser Verguss • Besonderheit des Bauteils: kompakte Bauform mit seitlicher Abstrahlrichtung 1,8 x 1,2 x 0,5 mm (LxBxH) • Wellenlänge: 570 nm (grün), 606 nm (orange), 633 nm (super-rot), 587 nm (gelb) • Abstrahlwinkel: horizontal 140°, vertikal 135° • Technologie: InGaAlP • optischer Wirkungsgrad: 5 lm/W (grün), 7 lm/W (super-rot), 11 lm/W (orange, gelb) • Gruppierungsparameter: Lichtstärke, Wellenlänge • Verarbeitungsmethode: für alle SMT-Bestücktechniken geeignet • Lötmethode: IR Reflow Löten • Vorbehandlung: nach JEDEC Level 2 • Gurtung: 8-mm Gurt mit 5000/Rolle, ø180 mm • ESD-Festigkeit: ESD-sicher bis 2 kV nach JESD22-A114-B Anwendungen • Flache Hinterleuchtung (LCD, Mobile Phone, Schalter, Display) • Signal- und Symbolleuchten • Markierungsbeleuchtung (z.B. Stufen, Fluchtwege, u.ä.) Features • package: SMT package, colorless diffused resin • feature of the device: compact package; side emitting LED; 1.8 x 1.2 x 0.5 mm (LxWxH) • wavelength: 570 nm (green), 606 nm (orange), 633 nm (super-red), 587 nm (yellow) • viewing angle: horizontal 140°, vertical 135° technology: InGaAlP • optical efficiency: 5 lm/W (green), 7 lm/W (super-red), 11 lm/W (orange, yellow) • grouping parameter: luminous intensity, wavelength • assembly methods: suitable for all SMT assembly methods • soldering methods: IR reflow soldering • preconditioning: acc. to JEDEC Level 2 • taping: 8 mm tape with 5000/reel, ø180 mm • ESD-withstand voltage: up to 2 kV acc. to JESD22-A114-B Applications • flat backlighting (LCD, cellular phones, switches, displays) • signal and symbol luminaire • marker lights (e.g. steps, exit ways, etc.) |
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