TL1431-EP

SLVS529D – APRIL 2004 – REVISED JANUARY 2015

www.ti.com

7 Specifications

7.1 Absolute Maximum Ratings

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Cathode voltage(2), VKA

37

V

Continuous cathode current, IKA

–100

150

mA

Reference input current, II(ref)

–0.00005

10

mA

Operating virtual junction temperature(3), TJ

150

°C

Lead temperature 1.6 mm (1/16 inch) from case for 10 s

260

°C

Storage temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to ANODE, unless otherwise noted.

(3)

Long-term high-temperature storage and/or use at the absolute maximum ratings may result in a reduction of overall device life. See

www.ti.com/ep_quality for additional information on enhanced plastic packaging.

7.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±4000

Electrostatic

V(ESD)

V

discharge

Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2)

±2000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

MIN

MAX

UNIT

VKA

Cathode voltage

VI(ref)

36

V

IKA

Cathode current

1

100

mA

TA

Operating free-air temperature

–55

125

°C

7.4 Thermal Information

TL1431-EP

THERMAL METRIC(1)

D

UNIT

8 PINS

RθJA(high)

Junction-to-ambient thermal resistance (high K board)

97

°C/W

RθJA(low)

Junction-to-ambient thermal resistance (low K board)

165

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Dissipation Rating Table

DERATING

TA = 70°C

TA = 85°C

TA = 125°C

PACKAGE

TA ≤ 25°C

FACTOR

ABSOLUTE

ABSOLUTE

ABSOLUTE

PACKAGE

THERMAL

POWER RATING

ABOVE TA =

MAXIMUM

MAXIMUM

MAXIMUM

IMPEDANCE

25°C

POWER RATING

POWER RATING

POWER RATING

97°C/W (High K

10 mW/°C

824 mW

670 mW

257 mW

board)

D

1102 mW

165°C/W (Low K

6 mW/°C

484 mW

393 mW

151 mW

board)

4

Submit Documentation Feedback

Copyright © 2004–2015, Texas Instruments Incorporated