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PACKAGE OUTLINE

C

0.625 MAX

0.35

0.15

1

TYP

0.25 TYP

6X

0.35

0.25

0.5

TYP

0.5 TYP

B

E

A

D

4219522/A 02/2015

DSBGA - 0.625 mm max height

YZC0006

DIE SIZE BALL GRID ARRAY

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. NanoFree

TM

package configuration.

NanoFree Is a trademark of Texas Instruments.

BALL A1

CORNER

SEATING PLANE

BALL TYP

0.08 C

A

1

0.015

C A

B

SYMM

SYMM

C

2

B

SCALE 9.000