ADC12DL065

www.ti.com

SNAS249D – MARCH 2005 – REVISED APRIL 2013

DC and Logic Electrical Characteristics

Unless otherwise specified, the following specifications apply for AGND = DGND = DR GND = 0V, VA = VD = +3.3V, VDR =

+2.5V, PD = 0V, External VREF = +1.0V, fCLK = 65 MHz, fIN = 10 MHz, tr = tf = 2 ns, CL = 15 pF/pin, Duty Cycle Stabilizer On,

parallel output mode. Boldface limits apply for TJ = TMIN to TMAX: all other limits TJ = 25°C

(1) (2) (3)

Units

Parameter

Test Conditions

Typical(4)

Limits(4)

(Limits)

CLK, PD, OEA, OEB DIGITAL INPUT CHARACTERISTICS

VIN(1)

Logical “1” Input Voltage

VD = 3.6V

2.0

V (min)

VIN(0)

Logical “0” Input Voltage

VD = 3.0V

1.0

V (max)

IIN(1)

Logical “1” Input Current

VIN = 3.3V

10

µA

IIN(0)

Logical “0” Input Current

VIN = 0V

−10

µA

CIN

Digital Input Capacitance

5

pF

DA0–DA11, DB0-DB11 DIGITAL OUTPUT CHARACTERISTICS

VDR = 2.5V

2.3

V (min)

VOUT(1)

Logical “1” Output Voltage

IOUT = −0.5 mA

VDR = 3V

2.7

V (min)

VOUT(0)

Logical “0” Output Voltage

IOUT = 1.6 mA, VDR = 3V

0.4

V (max)

VOUT = 2.5V or 3.3V

100

nA

IOZ

TRI-STATE Output Current

VOUT = 0V

−100

nA

+ISC

Output Short Circuit Source Current

VOUT = 0V

−20

mA

−ISC

Output Short Circuit Sink Current

VOUT = VDR

20

mA

COUT

Digital Output Capacitance

5

pF

POWER SUPPLY CHARACTERISTICS

PD Pin = DGND, VREF = VA

90

108

mA (max)

IA

Analog Supply Current

PD Pin = VD

12

mA

PD Pin = DGND

19

22

mA (max)

ID

Digital Supply Current

PD Pin = VD , fCLK = 0

0

mA

PD Pin = DGND, CL = 10 pF

(5)

15

mA

IDR

Digital Output Supply Current

PD Pin = VD, fCLK = 0

0

mA

PD Pin = DGND, CL = 10 pF

(6)

360

430

mW (max)

Total Power Consumption

PD Pin = VD

36

mW

Rejection of Full-Scale Error with

PSRR1

Power Supply Rejection Ratio

62

dB

VA =3.0V vs. 3.6V

(1)

The inputs are protected as shown below. Input voltage magnitudes above VA or below GND will not damage this device, provided

current is limited per Note 4 of the Absolute Maximum Ratings Table. However, errors in the A/D conversion can occur if the input goes

above VA or below GND by more than 100 mV. As an example, if VA is +3.3V, the full-scale input voltage must be ≤+3.4V to ensure

accurate conversions. See Figure 2.

(2)

To ensure accuracy, it is required that |VA–VD| ≤ 100 mV and separate bypass capacitors are used at each power supply pin.

(3)

With the test condition for VREF = +1.0V (2VP-P differential input), the 12-bit LSB is 488 µV.

(4)

Typical figures are at TJ = 25°C, and represent most likely parametric norms. Test limits are ensured to TI's AOQL (Average Outgoing

Quality Level).

(5)

IDR is the current consumed by the switching of the output drivers and is primarily determined by load capacitance on the output pins,

the supply voltage, VDR, and the rate at which the outputs are switching (which is signal dependent). IDR=VDR(C0 x f0 + C1 x f1 +....C11 x

f11) where VDR is the output driver power supply voltage, Cn is total capacitance on the output pin, and fn is the average frequency at

which that pin is toggling.

(6)

Excludes IDR. See DC and Logic Electrical Characteristics, Note 5.

Copyright © 2005–2013, Texas Instruments Incorporated

Submit Documentation Feedback

9

Product Folder Links: ADC12DL065