KB201 THRU KB207

Features

Mechanical Data

· Glass Passivated Die Construction

· Diffused Junction

· Low Forward Voltage Drop, High Current Capability

· Surge Overload Rating to 60A Peak

· Ideal for Printed Circuit Boards

· Case to Terminal Isolation Voltage 1500V

· Plastic Material - UL Flammability Classification 94V-0

Maximum Ratings And Electrical Characteristics

· Case : WOB Molded Plastic

· Terminals : Plated Leads Solderable per

MIL-STD-202, Method 208

· Polarity : As Marked on Case

· Weight : 1.3 grams (approx.)

· Mounting Position : Any

· Marking : Type Number

(Ratings at 25℃ ambient temperature unless otherwise specified, Single phase, half wave 60Hz, resistive or inductive

load. For capacitive load, derate by 20%)

CURRENT 2.0 Amperes

VOLTAGE 50 to 1000 Volts

Notes:

(1) Thermal resistance from junction to case mounted in PC board with 13 x 13mm (0.03mm thick) land areas.

(2) Measured at 1.0MHz and Applied Reverse Voltage of 4.0V DC.

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

RMS Reverse Voltage

Average Rectified Output Current

Non-Repetitive Peak Forward Surge Current,

8.3ms single half-sine-wave superimposed

on rated load per element (JEDEC method)

Volts

Forward Voltage (per element)

50

Volts

Symbols

Units

1.1

2.0

Amps

60

500

-65 to +150

℃

Amps

Peak Reverse Current at Rated

DC Blocking Voltage

Typical Junction Capacitance (Note 2)

Operating and Storage Temperature Range

KB201 KB202 KB203 KB204 KB205 KB206 KB207

35

5.0

16

100

70

200

140

400

280

600

420

800

560

1000

700

Volts

℃/W

pF

Io

Typical Thermal Resistance Junction to Case

40

℃

WOB

Dim

Min

Max

A

8.84

9.86

B

4.00

4.60

C

27.90

D

25.40

E

0.71

0.81

G

4.60

5.60

A ll Dimens ions in mm

A

B

D

E

G

G

C

+

-

+

-

μA