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LM2623

SNVS188I – MAY 2004 – REVISED OCTOBER 2017

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Copyright © 2004–2017, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration And Functions ........................ 3

6

Specifications......................................................... 4

6.1

Absolute Maximum Ratings ...................................... 4

6.2

ESD Ratings.............................................................. 4

6.3

Recommended Operating Conditions ....................... 4

6.4

Thermal Information .................................................. 4

6.5

Electrical Characteristics........................................... 5

6.6

Typical Characteristics .............................................. 5

7

Detailed Description .............................................. 7

7.1

Overview ................................................................... 7

7.2

Functional Block Diagram ......................................... 7

7.3

Feature Description................................................... 7

7.4

Device Functional Modes.......................................... 9

8

Applications And Implementation...................... 10

8.1

Application Information............................................ 10

8.2

Typical Application .................................................. 10

9

Power Supply Recommendations ...................... 12

10

Layout................................................................... 12

10.1

Layout Guidelines ................................................. 12

10.2

Layout Example .................................................... 13

10.3

WSON Package Devices ...................................... 13

11

Device And Documentation Support................. 14

11.1

Device Support...................................................... 14

11.2

Documentation Support ........................................ 14

11.3

Receiving Notification of Documentation Updates 14

11.4

Community Resources.......................................... 14

11.5

Trademarks ........................................................... 14

11.6

Electrostatic Discharge Caution ............................ 14

11.7

Glossary ................................................................ 14

12

Mechanical, Packaging, And Orderable

Information ........................................................... 14

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision H (November 2014) to Revision I

Page

•

Changed Handling Ratings table to ESD Ratings to comply with current format .................................................................. 4

•

Moved Storage temperature spec to Abs Max table ............................................................................................................. 4

•

Added separate row for SW pin HBM ESD rating ................................................................................................................. 4

•

Added condition to Recommended Operating Conditions table ............................................................................................ 4

•

Changed Updated RθJA value for NHE package from "40 – 56" to "46.5"°C/W and DGK package from "240" to

152.5" °C/W; added additional thermal information................................................................................................................ 4

Changes from Revision G (December 2005) to Revision H

Page

•

Added Device Information and Handling Rating tables, Feature Description, Device Functional Modes, Application

and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and

Mechanical, Packaging, and Orderable Information sections; moved some curves to Application Curves section .............. 1