4

LM2623

SNVS188I – MAY 2004 – REVISED OCTOBER 2017

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Copyright © 2004–2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

The maximum power dissipation must be derated at elevated temperatures and is dictated by Tjmax (maximum junction temperature),

RθJA (junction-to-ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any

temperature is Pdmax = (Tjmax – TA) / RθJA or the number given in the Absolute Maximum Ratings, whichever is lower.

6 Specifications

6.1 Absolute Maximum Ratings

(1) (2)

MIN

MAX

UNIT

SW pin voltage

–0.5

14.5

V

BOOT, VDD, EN and FB pins

–0.5

10

V

FREQ pin

100

µA

TJmax

(3)

150

°C

Lead temp. (soldering, 5 sec)

260

°C

Power dissipation (TA=25°C)

(3)

500

mW

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human-body model (HBM), per

ANSI/ESDA/JEDEC JS-001(1)

All pins except SW pin

±2000

V

SW pin (VSSOP package pin 8)

(WSON package pin 12 and pin

13)

±1000

Charged-device model (CDM), per JEDEC

specification JESD22-C101(2)

All pins

±500

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VDD pin

3

5

V

FB, EN pins

0

VDD

BOOT pin

0

10

V

Ambient temperature (TA)

−40

85

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

LM2623

UNIT

NHE (WSON)

DGK (VSSOP

14 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

46.5

152.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

37.7

53.9

°C/W

RθJB

Junction-to-board thermal resistance

23.6

73.2

°C/W

ψJT

Junction-to-top characterization parameter

0.4

5.5

°C/W

ψJB

Junction-to-board characterization parameter

23.8

72.0

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

4.6

N/A

°C/W